Listed as the Number 8 Gaffe by EETimes editors, 450mm took some knocks.
Quoting from the article:
“8. 450-mm fab dreams: Intel, TSMC and Samsung are separately pushing for 450-mm ”prototype” fabs by 2012. International Sematech is spearheading the effort. Late last year, Sematech updated its 450-mm fab roadmap–amid the worst downturn in the equipment industry. At a Sematech event, no one explained who would pay for the R&D or the 450-mm tools. One analyst said it best: Semiconductor equipment companies should boycott development of tools for the transition to 450-mm wafers, saying chip gear vendors were the losers in the transition to 300-mm wafers and would likely not benefit from the next move to larger wafers.”
The other 9 Gaffes are interesting as well.
