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Chip Companies Must Dig Deep for 450mm

March 24, 2010
by John
450mm, Austin, collaboration, cost, Dan Armbrust, Equipment, Preparation, SEMATECH, size, Surface, wafer
0 Comment

Dan Armbrust SEMATECH

In an article by David Lammers from Semiconductor International, David reports on comments from new SEMATECH CEO Dan Armbrust made at the SEMATECH Surface Preparation and Cleaning Conference in Austin this week:

“To be able to do 450 mm equipment development, it will require very significant contributions from those companies that want it…”  The R&D costs of 450 mm equipment development are so large that “these are bet-your-company propositions for the equipment vendors. Before you bet your company, you want to feel confident” that the semiconductor industry is ready to buy 450 mm equipment in volumes.

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