AENEAS is a non-profit industrial association established under French law that continues the activities of the ENIAC Platform and represents the Nanoelectronics RTD partners in the Joint Undertaking. It allows its members to participate in the Joint Technology Initiatives and provide the European Technology Platform with a legal backbone. Association to AENEAS is open to all European key players in Nanoelectronics, such as large industry, Small and Medium Enterprises, research institutes, academia, and associations.
The Spring Summit 2010, jointly organized by AENEAS and CATRENE, took place in Berlin at the Crowne Plaza City Centre Hotel on 4-5 May 2010. More than 105 participants took part in the event with a nice representation of all stakeholders in the European Nanoelectronics value chain including large companies, SMEs, universities, institutes and public authorities. Read about 450mm in following page…
The two-day program of the event was organized in order to provide an occasion for all interested parties to contribute to the further elaboration of a new strategic document for the nanoelectronics industry in Europe entitled Vision, Mission, and Strategy for European Micro- and Nano-electronics (VMS). The aim of this document is to provide a long-term roadmap for both R&D programs in this field, CATRENE and the ENIAC Joint Undertaking, while at the same time contributing to their harmonization and delineation.
Participants were introduced to the preliminary content of the document and invited to participate in working sessions on the following domains:
- Automotive and Transport,
- Energy Efficiency,
- Health and Ageing Society,
- Safety and Security,
- Design Technologies,
- Semiconductor Process and Integration,
- Equipment, Materials and Manufacturing.
From these working sessions, drafting teams have been formed for the writing of chapters on each of the above-mentioned domains. The chapters will focus on the Grand Challenges for each domain as well as on end terms including goals and timing.
The session on Equipment, Materials and Manufacturing is of particular importance as the group discussed timelines for various technologies in Semiconductor Manufacturing. Recognizing that this is a work in progress, it is still noteworthy that the milestone for High Volume Manufacturing on 450mm wafers is targeted for the year 2018.
This date is significant. It is becoming clear that 450mm will not happen without the financial support of chipmakers, suppliers, and governments alike. A target date of 2018 from a key stakeholder will seriously impact how 450mm is approached. On the positive side, the date appears more in line with the realities of funding and technology timing, and as such, would give all stakeholders more time to ensure a potential transition to 450mm wafers impacts not only wafer size and tool scale-up, but overall factory design.
This document is also important to read as the key contributors in drafting the document are identified – all highly regarded companies and experts, many of whom are members of the EEMI450 effort identified in the activities section of this site.