In an article by David Lammers from Semiconductor International, David reports on comments from new SEMATECH CEO Dan Armbrust made at the SEMATECH Surface Preparation and Cleaning Conference in Austin this week: “To be able to do 450 mm equipment development, it will require ver

SEMI Announces Nine New Technical Standards Documents Include Specification for High Purity Water for PV Processing and 450mm FOUP Interface SAN JOSE, Calif.  February 25, 2010 – SEMI has published nine new technical standards applicable to the semiconductor, MEMS, FPD and photo

SEMI’s Equipment Productivity Working Group (EPWG) is made up of Executives from Applied Materials, KLA-Tencor, Tokyo Electron, Brooks Automation, Lam Research, and Axcelis.  The analysis in the EPWG 450mm report issued by SEMI was performed by experts from the member companies

by Scotten W. Jones, IC Knowledge LLC This letter is in response to “The economic realities of 450mm” by SEMI’s John Ellis. February 19, 2010 – The possible transition to 450mm wafers would be an enormous undertaking for the entire semiconductor industry ecosys

Josephine Lien, Taipei; Jessie Shen, DIGITIMES [Wednesday 10 February 2010] Eighteen-inch wafers will replace 12-inch as the mainstream in 2015, according to Joo-Tai Moon, senior vice president of Samsung Electronics. Moon made the remarks during the SEMICON Korea trade show held Febr

In an article in Semiconductor International, a group in New York apparently has gotten word of a proposal to the State of New York for funding for 450mm development and has expressed their opposition.  In the article, the group expresses concern that the funding for 450mm research an

Intel and Micron jointly announced a 25nm NAND Flash product last week being ramped up at IMFlash, their joint venture. The new product will give them a large competitive advantage in the market.  EETimes covered the announcement, which was leaked early by an industry analyst.  Accord

At the Industry Strategy Symposium held at Half Moon Bay in California, a panel discussion had some of the large Equipment CEOs, including Lam Research (Steven Newberry), Novellus (Rick Hill), and KLA-Tencor (Rick Hill), as well as industry analysts, such from Gartner (Bob Johnson) an

Industry leaders convened at SEMICON Europa to hear the latest update from ISMI on 450 mm wafer size transition development, as well as long list of technology development requirements yet to be resolved. The conference, 450 mm In Europe: Quo Vadis (or “where do we go from here”) was

Listed as the Number 8 Gaffe  by EETimes editors, 450mm took some knocks. Quoting from the article: “8.  450-mm fab dreams:    Intel, TSMC and Samsung are separately pushing for 450-mm ”prototype” fabs by 2012. International Sematech is spearheading the effort. Late