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Chip Companies Must Dig Deep for 450mm

March 24, 2010
by John
450mm, Austin, collaboration, cost, Dan Armbrust, Equipment, Preparation, SEMATECH, size, Surface, wafer
0 Comment
In an article by David Lammers from Semiconductor International, David reports on comments from new SEMATECH CEO Dan Armbrust made at the SEMATECH Surface Preparation and Cleaning Conference in Austin this week: “To be able to do 450 mm equipment development, it will require ver
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