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  • Reports
    • EU commission 450mm Report (2012)
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    • 450mm SEMI EPWG Report – English Version (2008)
    • 450mm Wright Williams & Kelly
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Caution Ahead for 450mm?

December 19, 2013
by Admin
450mm, ASML, EUV, Global Foundries, Intel, litho, Samsung, TSMC
0 Comment
Caution Ahead on 450mm At one point, it seemed everything was lining up very well for 450mm: a consortium of the proponents (G450C), a post-450mm delivery of EUV (along with significant investment in ASML), and some agreed-upon industry deadlines, and many 450mm-specific industry grou
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New Consortia: Are Chipmakers Missing?

June 28, 2013
by Admin
450mm, EU, European, F450C, G450C, Globalfoundries, IBM, Intel, Samsung, TSMC
0 Comment
Consortia Galore Last week, Mark LaPedus at SemiMD put together a great article about the latest surge in 450mm consortia and consortium-like 450mm projects. It appears that 450mm R&D is poised to really take off with the formation of these new groups. After reading the piece, I w
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Making 450mm Work for Foundries

October 29, 2012
by Admin
300mm, 450mm, foundries, Intel, ismi, Prime, Samsung, semiconductor, TSMC, wafer
0 Comment
300 Prime   Face it, 300mm Prime didn’t really happen. The industry, as a whole, had a chance to optimize 300mm fabs for cycle time and productivity, and maximize the investment. There was particular benefit available for high-product-mix manufacturers. Instead, 300mm Prime became Nex
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Schrödinger’s 450mm Cat – Dead or Alive?

October 25, 2012
by Admin
2018, 450, 450 mm, 450mm, economics, foundries, Global, Intel, MIT model, Samsung, SEMI, semiconductor, Timing, TSMC, wafer
2 Comments
I was wrong on 450mm. But first, a caveat. When speaking out on the subject in 2007, I wasn’t necessarily wrong. Nor in 2008, 2009, or even in 2010, though there were some signs my position was weakening. 2011? I was busy marketing a book. (Shameless plug… buy “Dormant Curse”.) By 201
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A 450mm World…Preparing for Battle

September 26, 2012
by Admin
2018, 450, 450mm, consolidation, date, foundries, Global, Intel, mm, Samsung, semiconductor, Timing, TSMC, wafer
0 Comment
450mm Schedule By all appearances, 450mm, an industry disruption, is now on track. In recent announcements, Intel effectively decoupled EUVL from 10nm, which allows the 2018, 450mm target date to stand intact regardless of any EUV slip. If EUV is delayed to 7nm, there’s still a 450mm
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TSMC Slips 450mm to 2018: Is Anyone Surprised?

September 05, 2012
by Admin
10nm, 2015, 2018, 450, 450mm, Intel, mm, Samsung, semiconductor, technology, TSMC, wafer
0 Comment
Taiwan Semiconductor Manufacturing Company has made public what many in the industry have known for some time: Don’t expect 450mm until 2018. In an article in the Taiwan Times, TSMC’s technology roadmap is discussed, which now includes 10nm transistors on 450mm in 2018 (hi
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ISMI Update on 450mm at SEMICON West

July 22, 2010
by Admin
450mm, Intel, ismi, Samsung, SEMATECH, SEMICON, TSMC, update
Comments are off
Each year at SEMICON West, ISMI provides a closed-door progress report on their 450mm program.
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450mm in 2015 on Chinese Equipment. Report from IEF 2010.

May 06, 2010
by Admin
2010, 2015, 450mm, Bosson, Chinese, IEF, Sun, TSMC
0 Comment
In a talk at the International Electronics Forum being held in Dresden this week, Dr. Jack Sun, CTO of TSMC had stated that he expected 450mm had been delayed until 2015 from the original target date of 2012 due to the credit crunch.  “The device manufacturers and governments al
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