In 2009 the European Semiconductor Equipment and Materials industry decided to form a 450mm dedicated initiative, called EEMI450, to bring the interested parties together, to promote common 450mm efforts and to induce common 450mm European projects.  Currently, this Initiative has mor

The past few weeks the industry has been hit hard with the news that Intel, Samsung, TSMC, Global Foundries and IBM will all be putting money towards a consortium for collectively working on R&D for the use of 450mm wafers. While some in the industry remain skeptical that 450mm wi

Each year at SEMICON West, ISMI provides a closed-door progress report on their 450mm program.

  In an article at EETimes, Mark LaPedus reports out on what was going on at SEMICON West this year in regards to 450mm efforts.  His update includes status from ISMI, SEMI, Semico, VLSI Research and a variety of experts.   The key message is that things look somewhat nebulous ri

The European Commission has a call for proposals to receive funding to study what the government's role should be in 450mm

(July 14, 2010) — SEMI published eight new technical standards applicable to the semiconductor, MEMS, FPD and photovoltaic (PV) manufacturing industry. The new standards, developed by technical experts from equipment and materials suppliers, device manufacturers and other compan

By Ian McLeod, SEMI North America 2010 is a significant year in 450mm wafer standards document development. The SEMI Standards program is overseeing increasing document development activities related to 450mm-related standards reflecting the increased attention and interest being give

“The industry cannot stagnate at the existing 300 mm wafer technology…every time an industry executive says we can’t afford the R&D, it sends a discouraging message to all the young, creative engineers: the semiconductor industry is stagnant, protecting profit margins instea

SEMI M76-0710:   Specification for 450 mm Diameter Mechanical Handling Polished Wafers This standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on April 30, 2010. Initially ava