Latest Updates
Semico Research: 450mm will happen, eventually
May 26, 2010
0 Comment
In a report on EETimes, Jim Feldham has announced a new report by Semico Research entitled, “450mm Wafer Manufacturing: Who Needs It?” From the EETimes article: “The [semiconductor] industry will not stagnate at the existing 300-mm process technology,” said Ji
Continue Reading →European Nanoelectronics Initiative: 450mm in 2018
May 11, 2010
AENEAS is a non-profit industrial association established under French law that continues the activities of the ENIAC Platform and represents the Nanoelectronics RTD partners in the Joint Undertaking. It allows its members to participate in the Joint Technology Initiatives and provid
Continue Reading →450mm in 2015 on Chinese Equipment. Report from IEF 2010.
May 06, 2010
In a talk at the International Electronics Forum being held in Dresden this week, Dr. Jack Sun, CTO of TSMC had stated that he expected 450mm had been delayed until 2015 from the original target date of 2012 due to the credit crunch. “The device manufacturers and governments al
Continue Reading →WWK Concludes Semiconductor Manufacturing Survey
April 14, 2010
From David Jiminez of Wright Williams & Kelly, posted on “Linked-In“: “WWK Concludes 2010 Semiconductor Manufacturing Technology Survey Participants in the survey have now received their results summary. While the full results are only available to participants,
Continue Reading →CyberOptics Rolls Out 450 mm Line Metrology Sensors
April 06, 2010
WILSONVILLE, OR, Apr 06, 2010 (MARKETWIRE via COMTEX) — The R&D group at CyberOptics Semiconductor has signed off on a line of wireless 450 mm wafer processing metrology sensors developed in conjunction with industry standards to help chipmakers and tool manufacturers qualif
Continue Reading →Chip Companies Must Dig Deep for 450mm
March 24, 2010
In an article by David Lammers from Semiconductor International, David reports on comments from new SEMATECH CEO Dan Armbrust made at the SEMATECH Surface Preparation and Cleaning Conference in Austin this week: “To be able to do 450 mm equipment development, it will require ver
Continue Reading →SEMI Posts new standards, including 450mm FOUP specification
March 04, 2010
SEMI Announces Nine New Technical Standards Documents Include Specification for High Purity Water for PV Processing and 450mm FOUP Interface SAN JOSE, Calif. February 25, 2010 – SEMI has published nine new technical standards applicable to the semiconductor, MEMS, FPD and photo
Continue Reading →EPWG 450mm Public Session at SEMICON West 2008
February 19, 2010
SEMI’s Equipment Productivity Working Group (EPWG) is made up of Executives from Applied Materials, KLA-Tencor, Tokyo Electron, Brooks Automation, Lam Research, and Axcelis. The analysis in the EPWG 450mm report issued by SEMI was performed by experts from the member companies
Continue Reading →Setting the record straight on 450mm
February 19, 2010
by Scotten W. Jones, IC Knowledge LLC This letter is in response to “The economic realities of 450mm” by SEMI’s John Ellis. February 19, 2010 – The possible transition to 450mm wafers would be an enormous undertaking for the entire semiconductor industry ecosys
Continue Reading →