Listed as the Number 8 Gaffe by EETimes editors, 450mm took some knocks. Quoting from the article: “8. 450-mm fab dreams: Intel, TSMC and Samsung are separately pushing for 450-mm ”prototype” fabs by 2012. International Sematech is spearheading the effort. Late
Semiconductor Equipment Companies Need To Boycott 450mm Development Says The Information Network NEW TRIPOLI, PA, April 16, 2009 . . . The planned transition to 450mm diameter silicon wafers for semiconductor production will be disastrous for the equipment industry, according to the r
Semiconductor International has recently provided an article detailing how ISMI has posted equipment metrics for 450mm on their website. It is still unclear who would pay for the R&D required if 450mm happens, but it is an interesting discussion. A new twist in the discussion is
On March 24, 2008, the EU and Taiwan held a joint workshop on 450mm. The presentation abstracts for the event are available, as well as the full presentations for many of the topics.
Consistent with other estimates, participants in the IEDM conference panel discussion estimated the cost of a 450mm fab, if and when it might appear, to cost on the order of $10B. No one is talking about when a fab might appear, though. The coverage can be found here.
This year’s report is a comprehensive, well documented and written report about the future of Europe’s electronics industry. It is 80 pages in length, packed full of detailed information. It is interesting to note that only one (1) paragraph mentions 450mm. The report ca
Early analysis of 450mm cost/benefit by SEMI and by Wright Williams and Kelly had assumed “reasonable” wafer prices. If Dean Freeman is right in his assessment of early wafer costs, not only will the cost/benefit of 450mm be significantly impacted (from a ‘near-zero
ISMI has annouced their latest plans for 450mm. With the economic downturn, it may be very difficult to talk seriously about any real plans for a 2012 pilot line. Link to article -> Here